| Category | Parameter | DGL-E | DGL-F | DGL-S |
|---|---|---|---|---|
| Accuracy | Printing Accuracy | ±25 μm @ 6σ, CPK ≥ 2.0 | ±30 μm @ 6σ, CPK ≥ 2.0 | ±30 μm @ 6σ, CPK ≥ 2.0 |
| Repeat Position Accuracy | ±10 μm @ 6σ, CPK ≥ 2.0 | ±15 μm @ 6σ, CPK ≥ 2.0 | ±15 μm @ 6σ, CPK ≥ 2.0 | |
| Cycle Time | 15 s | 15 s | 17 s | |
| Screen Frame | Screen Frame Size | 737×737 mm – 1200×900 mm | 737×300 mm – 1800×737 mm | 737×300 mm – 2300×737 mm |
| Screen Frame Fixed | Cylinder | |||
| Platform | Platform Adjustment Range | X: ±6 mm Y: ±6 mm | ||
| Platform Adjustment Angle | Z: ±2° | |||
| PCB | Print Size | Standard: Min 100×80 mm Max 850×610 mm |
Standard: Min 80×50 mm Max 1500×510 mm |
Standard: Min 80×50 mm Max 2000×510 mm |
| PCB Thickness | 0.4 – 6 mm | |||
| PCB Weight | ≤ 4 kg | |||
| Transportation | Direction | L→R, L→L, R→L, R→R | ||
| Speed | 100 – 1500 mm/s (programmable) | |||
| Height | 900 ± 40 mm | |||
| Separation | Demoulding Method | Separation after squeegee up; squeegee up after separation | ||
| Demoulding Speed | 0.1 – 20 mm/s | |||
| Demoulding Distance | 0 – 30 mm | |||
| Operating Conditions | Voltage | 220 V ±10%, Single phase, 50/60 Hz | ||
| Power | 3 kW | |||
| Air Supply | 4.5 – 6 kgf/cm² | |||
| Gas Consumption | 0.5 ml/s | |||
| Safety Performance | Insulation Resistance | 1 kV / 3 MΩ | ||
| Grounding Resistance | ≤ 0.1 Ω | |||
| Operating Noise | ≤ 87 dB | |||
| Dimensions | Machine Size (L×W×H) | 1710 × 1750 × 1550 mm | 2600 × 1235 × 1545 mm | 3100 × 1405 × 1565 mm |
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Solder Paste Printer DGL Series
Original price was: $48,000.00.$45,000.00Current price is: $45,000.00.
PCB Solder Paste Printer DGL Series is a high-precision machine designed for SMT production lines. It features an advanced vision alignment system, adjustable squeegee pressure, and user-friendly operation. Ideal for small to medium-sized PCBs, it ensures accurate paste deposition for consistent soldering quality, boosting productivity and reducing defects in electronic assembly.
Specifically designed for long led pcb boards
High speed of 50,000CPH
By positioning the laser sensor closer to the board and reducing travel time from pick-up to placement, the one-head mounter achieves an optimal speed of 50,000 CPH in its ideal conditions
TAKUMI Head
This 8-nozzle “TAKUMI Head” accommodates components of varying heights, from the smallest to the largest, ensuring optimal
speed and accuracy.
Component height can be selected from six levels: 1, 3, 6, 12, 20, and 25 mm.
High Precision
Detects lead floating and BGA ball deformation to prevent the placement of defective components. High-precision coplanarity checks enhance product reliability.
Component Management
Top production efficiency is achieved by continuous monitoring of component consumption and communication with the Automated Component Storage and Transport System.
112 feeder mounting
The compact, lightweight, and slim design of the RF feeder supports up to 112 feeder units (front and rear combined),
enabling high-efficiency production.
Wide component range
Supports components from sizes as small as 03015 up to 74 mm square or 50 mm x 150 mm, with placement heights accommodating components up to 25 mm
Manufacturing Electronics
Range of Applications
Primary Applications
PCB Assembly Manufacturing - The core use of reflow oven is used after the Pick and Place machine, This includes everything from consumer electronics (smartphones, tablets, computers) to industrial equipment and automotive electronics.
Description
Additional information
| Weight | 1200 kg |
|---|---|
| Dimensions | 120 × 100 × 80 cm |
| Brand |
Desen |
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About brand
Desen Precision is committed to delivering high-end intelligent electronic equipment, advanced automation solutions, and innovative robot applications for the electronics manufacturing industry. As a trusted SMT equipment supplier, we provide precision assembly solutions that help manufacturers worldwide achieve superior production efficiency and quality.
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