| Specification | R-0802 | R-0802D |
|---|---|---|
| Dimensions (L×W×H) | 5310 × 1353 × 1490 mm | 5310 × 1583 × 1490 mm |
| Exhaust Volume | ≥10 m³/min × 2 channels | |
| Startup Power | 28 kW / 30 kW (N₂) | 32 kW / 34 kW (N₂) |
| Normal Power Consumption | 9–10 kW | 10–11 kW |
| Heating Zones (Top / Bottom) | 8 / 8 | 8 / 8 |
| Heating Zone Length | 3110 mm | 3110 mm |
| Warm-up Time | Approx. 25 min | Approx. 30 min |
| Temperature Setting Range | Room temperature – 300 °C | |
| Temperature Control Type | PID closed-loop control, SSR driven | |
| Temperature Control Precision | ±1 °C | |
| Max Temperature Difference (Zones) | ≤40 °C | |
| PCB Temperature Deviation | ±1.5 °C | |
| Cooling Zones | 2 | 2 |
| Cooling Zone Length | 800 mm | 800 mm |
| Max PCB Width | 50–400 mm | Dual lane: 50–280 mm |
| Conveyor Height | 900 ± 20 mm | |
| Conveyor Speed | 300–2000 mm/min | |
| Conveyor Direction | Left → Right (Right → Left optional) | |
| Power Supply | 3-phase 380 V, 50/60 Hz (220 V optional) | |
| N₂ Consumption | Single lane: 18–20 m³/h (300–1000 ppm) Dual lane: 25–30 m³/h (300–1000 ppm) | |
| Alarm System | Sound & light (Yellow: warning · Green: normal · Red: fault) | |
| Data Storage | Unlimited process & status data storage | |
| IPC-CFX / IPC-Hermes | Optional | |
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Reflow Oven Machine 6 zones
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Professional reflow ovens for SMT and electronics manufacturing. Our range includes multi-zone convection systems with precise temperature control for lead-free and leaded soldering. Available in benchtop to industrial conveyor models with nitrogen compatibility, programmable profiles, and energy-efficient operation for high-volume PCB assembly.
High speed of 50,000CPH
By positioning the laser sensor closer to the board and reducing travel time from pick-up to placement, the one-head mounter achieves an optimal speed of 50,000 CPH in its ideal conditions
TAKUMI Head
This 8-nozzle “TAKUMI Head” accommodates components of varying heights, from the smallest to the largest, ensuring optimal
speed and accuracy.
Component height can be selected from six levels: 1, 3, 6, 12, 20, and 25 mm.
High Precision
Detects lead floating and BGA ball deformation to prevent the placement of defective components. High-precision coplanarity checks enhance product reliability.
Component Management
Top production efficiency is achieved by continuous monitoring of component consumption and communication with the Automated Component Storage and Transport System.
112 feeder mounting
The compact, lightweight, and slim design of the RF feeder supports up to 112 feeder units (front and rear combined),
enabling high-efficiency production.
Wide component range
Supports components from sizes as small as 03015 up to 74 mm square or 50 mm x 150 mm, with placement heights accommodating components up to 25 mm
Manufacturing Electronics
Range of Applications
Primary Applications
PCB Assembly Manufacturing - The core use of reflow oven is used after the Pick and Place machine, This includes everything from consumer electronics (smartphones, tablets, computers) to industrial equipment and automotive electronics.
Description
Additional information
| Weight | 1200 kg |
|---|---|
| Dimensions | 120 × 100 × 80 cm |
| Brand |
Desen |
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About brand
Desen Precision is committed to delivering high-end intelligent electronic equipment, advanced automation solutions, and innovative robot applications for the electronics manufacturing industry. As a trusted SMT equipment supplier, we provide precision assembly solutions that help manufacturers worldwide achieve superior production efficiency and quality.
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