| Parameter | Q600 | M400 | NE1500 |
|---|---|---|---|
| Working Range (X/Y/Z) |
450×450×60 mm (single valve & conveyor) 350×450×40 mm (single valve & dual valves) 300×450×40 mm (rotate and tilt) |
400×500×50 mm (single valve dispensing) 250×500×50 mm (dual synchronized valves) 250×450×50 mm (rotate and tilt) |
1500×450×50 mm (single valve dispensing) 1500×350×40 mm (dual synchronized valves) 1500×350×40 mm (rotate and tilt) |
| Position Accuracy |
XY: ±30 μm @ 3σ Z: ±10 μm @ 3σ |
XY: ±20 μm @ 3σ Z: ±10 μm @ 3σ |
XY: ±40 μm @ 3σ Z: ±10 μm @ 3σ |
| XYZ Repeat Position Accuracy |
XY: ±15 μm @ 3σ Z: ±5 μm @ 3σ |
XY: ±10 μm @ 3σ Z: ±5 μm @ 3σ |
XY: ±20 μm @ 3σ Z: ±5 μm @ 3σ |
| Maximum Speed | 1000 mm/s (XY) | 2000 mm/s (XY) | 1000 mm/s (XY) |
| Acceleration | 1.0 g | 2.5 g | 1.0 g |
| Motion Driven Mode | Servo motor + ball screw | Linear motor + grating scale | Servo motor + ball screw Linear motor + grating scale |
| Vision System | CCD | ||
| CCD Pixel | 130W | ||
| Programming | Inline / Offline programming | ||
| Power Supply | AC 220 V ±10%, 50–60 Hz | ||
| Total Power | 2.5 kW (without PCB heating module) | 2.0 kW (without PCB heating module) | 4.0 kW (without PCB heating module) |
| External Size | 910 × 1440 × 1510 mm | 910 × 1510 × 1500 mm | 2060 × 1300 × 1620 mm |
| Weight | Approx. 800 kg | Approx. 1200 kg | Approx. 1200 kg |
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Automatic Glue Dispenser Machine
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Automatic Glue Dispenser Machine
DESEN Automatic High-Speed Dispenser offers precision solder paste dispensing for SMT and electronics manufacturing. Available in three models (Q600, M400, NE1500) with CCD vision system, high-speed operation up to 2000mm/s, and exceptional accuracy. Ideal for PCB assembly and automated production lines.
High speed of 50,000CPH
By positioning the laser sensor closer to the board and reducing travel time from pick-up to placement, the one-head mounter achieves an optimal speed of 50,000 CPH in its ideal conditions
TAKUMI Head
This 8-nozzle “TAKUMI Head” accommodates components of varying heights, from the smallest to the largest, ensuring optimal
speed and accuracy.
Component height can be selected from six levels: 1, 3, 6, 12, 20, and 25 mm.
High Precision
Detects lead floating and BGA ball deformation to prevent the placement of defective components. High-precision coplanarity checks enhance product reliability.
Component Management
Top production efficiency is achieved by continuous monitoring of component consumption and communication with the Automated Component Storage and Transport System.
112 feeder mounting
The compact, lightweight, and slim design of the RF feeder supports up to 112 feeder units (front and rear combined),
enabling high-efficiency production.
Wide component range
Supports components from sizes as small as 03015 up to 74 mm square or 50 mm x 150 mm, with placement heights accommodating components up to 25 mm
Manufacturing Electronics
Range of Applications
Primary Applications
PCB Assembly Manufacturing - The core use of reflow oven is used after the Pick and Place machine, This includes everything from consumer electronics (smartphones, tablets, computers) to industrial equipment and automotive electronics.
Description
Additional information
| Weight | 1200 kg |
|---|---|
| Dimensions | 120 × 100 × 80 cm |
| Brand |
Desen |
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About brand
Desen Precision is committed to delivering high-end intelligent electronic equipment, advanced automation solutions, and innovative robot applications for the electronics manufacturing industry. As a trusted SMT equipment supplier, we provide precision assembly solutions that help manufacturers worldwide achieve superior production efficiency and quality.
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